Technology Overview  
 

The MESA products provide high-resolution 3D image data in real time. At the heart of the camera is an advanced sensor technology employing the time-of-flight (TOF) distance measurement principle. Infrared light from the camera's internal lighting source is reflected by objects in the scene and travels back to the camera, where its precise time of arrival is measured independently by each of tens of thousands of sensor pixels. 
 
MESA�s sensor chips are fabricated at a commercial foundry and employ a CCD/CMOS process that allows independent optimization of the optical and electronic functional blocks. The result is a sensor whose underlying noise performance, and consequently the corresponding distance measuring capability, exceeds that of sensors fabricated using standard CMOS pixel/process combinations. 
 
Camera development and manufacturing take place at MESA facilities in Z�rich, Switzerland.